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Semiconductors / Electronics

Halbleiter-Elektronik-001

A global and innovative industry needs this type of partner

The fast growth in the electronics industry and Moore's law require continually increasing productivity combined with cost optimization. A high level of innovation, top quality, international standards and worldwide support make B&R a preferred partner.

Halbleiter-Elektronik-002

Integration provides a competitive edge

Not only can machine and system performance be drastically improved by completely integrating control, motion and visualization tasks, communication times can be considerably reduced as well. Our consistent implementation of standardized, open structures for communication, programming, data handling, and functionality provide a decisive competitive edge. The total integration of all automation components in a central development tool as well as hardware components that can be identified clearly at any time form the foundation of complete transparency during development and operation.

iStock - Total Cost of Ownership

Total cost of ownership

In a competitive market, system decisions are increasingly being made based on total cost. An exceptional level of system availability, excellent machine performance, uniform operation, easy-to-use modular devices, compatibility throughout the entire system and an effective worldwide support network guarantee a substantial reduction in total cost. With B&R, you gain a partnership that pays off.

Uhr 24-7

Highest level of availability

In the semiconductor industry, the availability of systems and machines is an absolute necessity. Minimized downtime is just as important as smooth automation. Intuitive and sophisticated diagnostic functions and open interfaces provide support, as does B&R's role as an international and knowledgeable partner.

Halbleiter-Elektronik-008

The line solution

Many electronics manufacturers are now required to make product changes and adjustments on a regular basis. Integrated and well-matched hardware and software are enormously helpful here. Even line configurations can be set up in a few minutes offline and with the click of a mouse, reducing changeover times and downtime while increasing efficiency and productivity. Continuous communication between individual machines and to higher-level production planning and control systems guarantees complete recording and traceability of the entire process.

Halbleiter-Elektronik-004

Highest possible precision

Speed and precision are not contradictions – high-performance control electronics with built-in intelligence are used to control the process in the microsecond range. Real-time industrial Ethernet is the foundation for synchronized interaction between individual sub-processes. Continued development guarantees that B&R meets the requirements of the industry and the market in this ever-changing field.

Halbleiter-Elektronik-005

Open system architecture

Innovation is key. With this guiding principle and a completely open system structure, B&R is an ideal partner for all companies that are also clearly focused on innovation. In addition to the integration of highly sophisticated algorithms (programmed in C, for example), dynamic I/O configurations make it possible to use the same software on different hardware topologies.

Halbleiter-Elektronik-007

Process security

Inline quality control, flexible product identification and product tracking are requirements for high-quality electronic components. Continued development guarantees that B&R meets the requirements of the industry and the market in this ever-changing field.

Wafer manufacturing
01 Wafer Fabrication
  • Control of the melting temperature
  • Clean room technology
  • Highest possible precision
  • Extremely smooth surfaces
Lithography
02 Litographie
  • High-speed platesetter setup
  • Etching process monitoring
  • Time-critical production steps
  • Non-stop parallel processing
Wafer doping
03 Wafer Dosing
  • Vapor pressure and vacuum control
  • Ion beam control
  • Highly precise temperature control
  • Gas concentration control
Chemical-mechanical planarization
04 CMP
  • Polishing agent application control
  • Speed control
  • Highest possible precision
  • Extremely precise pressure control
Wafer mounting & die separation
05 Wafer Mounting Cutting
  • Pick-and-place applications
  • Precise positioning
  • Direct drive units
  • Online positioning correction
  • Drive-based measurement system
Wire bonding
06 Wire Bond
  • Real-time synchronization
  • High-speed movements
  • High-performance cam profiles
  • Shortest possible movement profiles
  • Direct force control using servo drives
FlipChip
07 Flip Chip
  • Tracing and management
  • Integration of linear motors
  • High-speed vision integration for target position correction
  • Optimized movement profiles for high-speed placing
  • Force and position control
Enclosures
08 Encapsulating and Trim and Form
  • High-speed data acquisition and storage
  • Form protection via software
  • Fast changes between movement and force control
  • Movement profiles for optimal module processes
  • Bent lever compensation
IC test handler
09 IC Testhandler
  • Direct drives for turn tables without indexers
  • Optimized movement using cam profiles
  • GB-IP interface
  • Simple integration of measurement hardware
Laser marking
10 Laser Marking
  • Synchronized movement sequences
  • Control of additional external devices
  • Product detection using trigger input
  • Online quality data acquisition
  • Customized product labels
Visual inspection
11 Visual Inspection
  • Synchronized movement sequences
  • Control of additional external devices
  • Product detection using trigger input
  • Online quality data acquisition
  • Customized product labels
Packaging
12 Stacking
  • Trigger positioning
  • Synchronous system
  • Product tracing
  • Automatic format configuration
  • Consistent sealing times
Automatic placement machines
13 PCB
  • Movements optimized for short positioning times
  • Highest possible precision with a short settling time
  • High-speed data communication with subsystems
  • Precise placement of components for the highest quality
Soldering processes
14 Hot Flow Oven
  • Temperature zone control
  • Online temperature profile changes
  • Integrated Visualization
  • Nitrogen atmosphere
  • RoHS
In-circuit testing
15 In Circuit Test
  • Various drive concepts available
  • Shortest possible settling times for stabilization
  • Optimal integration of measurement devices
  • Fast product changeovers
Assembly – Pick-and-place
16 Assembling
  • Integration of various robot kinematics
  • Emphasis on shortest cycle times for highest throughput
  • Digitalized process control
  • ERP link
Ejemplo
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