Packaging solutions 03/2015
Dear Sir or Madam,
The countdown to PACK EXPO Las Vegas is running. The show is expected to attract 30,000 processing and packaging professionals and more than 2,000 exhibiting companies. From September 28-30, B&R will feature automation solutions designed to simplify programming and improve performance and scalability. Visit us at booth S-5956 in the South hall and let us know what we can do for your packaging automation strategy.
Director, Business Development
mapp technology simplifies packaging automation
North American packaging machinery users and OEMs appreciate the clarity of familiar ladder logic programming.
But as machine functionalities become more sophisticated, ladder programs can become too complicated, even when supplemented by function blocks.
mapp technology from B&R maintains familiar, IEC compliant ladder and function block programming – except with mapp components you configure more and program less.
At PACK EXPO Las Vegas Booth S-5956, see how mapp technology can cut programming time by 67%, while simplifying recipe changes, diagnostics, integration, field modifications.
Programm less, configure more. Download the mapp white paper to get an insight in the concept behind.
To run the ultra-integrated smart factories of Industry 4.0, programmers are having to write increasingly complex software. As they do, the cost of developing and maintaining this software is skyrocketing. Intelligently linked mapp components allow you to create and support even the most complex solutions faster and easier.
The Pack Solutions Challenge sponsored by B&R is an annual student contest where teams from PMMI Partner Schools research and develop a real-world packaging solution. The 7th Annual Challenge will take place at PACK EXPO Las Vegas, September 28-30, 2015. The proposals will be presented to a panel of end users on Tuesday, Sept. 29. If we have aroused your interest - click here to find out more about the issue.