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Branch > Semiconductor Industry
Semiconductor Industry

The line solution

Electronic manufacturing requires quick product changes and adjustments in many cases. Integrated and well-matched hardware and software help here. Even line configurations can be set up in a few minutes offline with the click of a mouse, which reduces changeover-time and downtime and increases efficiency and productivity. Continuous communication between the individual machines and to higher-level production planning and control systems guarantees complete recording and traceability of the entire process.

Highest possible precision

Speed and precision are not contradictions - high-performance control electronics with built-in intelligence controls processes in the microsecond range. Real-time industrial Ethernet is the foundation for synchronized interaction between individual sub-processes. Continued development guarantees that B&R meets the requirements of the industry and market in this ever-changing area.

Open system architecture

Innovation is key. With this guiding principle and a completely open system structure. B&R is an ideal partner for all companies that also clearly focus on innovation. In addition to the integration of highly sophisticated algorithms e.g. in "C", the dynamic I/O configuration makes it possible to always use the same software on different hardware topologies.

Process security

Inline quality control, flexible product identification and product tracking are requirements for high-quality electronic components. Continued upgrades guarantee that B&R meets the requirements of the industry and market in this ever-changing area. The total integration of all automation components in a central development tool as well as hardware components that can be identified clearly at any time form the foundation of complete transparency during development and operation.

A global and innovative industry needs equal partners

The fast growth in the electronic industry and Moore's law require continually increasing productivity combined with cost optimization. A high level of innovation, top quality, international standards and worldwide support make B&R a preferred partner.

Integration provides a competitive edge

Through complete integration of control, motion and visualization, which results in greatly minimized communication times, the performance of machines and systems can be drastically increased. Our consistent implementation of standardized, open structures for communication, programming, data handling and functionality provide a decisive competitive edge.

Total cost of ownership

Through complete integration of control, motion and visualization, which results in greatly minimized communication times, the performance of machines and systems can be drastically increased. Our consistent implementation of standardized, open structures for communication, programming, data handling and functionality provide a decisive competitive edge.

Highest level of availability

In the semiconductor industry, the availability of systems and machines is an absolute necessity. Minimized downtime is as important as smooth automated operation. Intuitive and sophisticated diagnostics functions and open interfaces provide support as does an international and knowledgeable partner.

Our know-how for your processes

Wafer doping

  • Vapor pressure and vacuum control
  • Ion beam control
  • Highly precise temperature control
  • Gas concentration control

Lithography

  • High-speed platesetter set-up
  • Etching process monitoring
  • Time-critical production steps
  • Non-stop parallel processing

Wafer manufacturing

  • Control of the melting temperature
  • Clean room technology
  • Highest possible precision
  • Extremely smooth surfaces

Wire bond

  • Real-time synchronization
  • High-speed movements
  • High-performance cam profiles
  • Shortest possible movement profiles
  • Direct force control using servo drives

Wafer mounting & die separation

  • Pick & place applications
  • Precise positioning
  • Direct drive units
  • Online position correction
  • Drive as measurement system

Chemical-mechanical planarization

  • Polishing agent application control
  • Speed control
  • High level of precision
  • Ultra-low downforce

IC test handler

  • Direct drive for turn table without indexer
  • Optimized movement using cam profiles
  • GB-IP interface
  • Simple integration of measurement hardware

Chip encapsulation

  • Fast data acquisition and storage
  • Form protection function via software
  • Fast changes between movement and force control
  • Movement profile for an optimal module process
  • Bent lever compensation

Flip chip

  • Tracing and management
  • Integration of linear motors
  • High-speed vision control integration for target position correction
  • Optimized movement profiles for highspeed placing
  • Force and position control

Chip packaging

  • Trigger positioning
  • Synchronous system
  • Product tracking
  • Automatic format configuration
  • Constant sealing times

Visual inspection

  • Fast data acquisition
  • Tracing and management
  • Movement sequences synchronized to the vision control system
  • Fast I/O reactions for discharging products

Laser labeling

  • Synchronized movement sequences
  • Control of additional external devices
  • Product recognition using trigger input
  • Online quality data acquisition
  • Customized product labels

In-circuit test

  • Various drive concepts are available
  • Shortest possible settling times for stabilization
  • Efficient integration of measurement devices
  • Fast product changes

Soldering processes

  • Temperature zone control
  • Online changing of the temperature profile
  • Integrated visualization
  • Nitrogen atmosphere
  • RoHs

Automatic placement

  • Movements optimized for short positioning times
  • Highest possible precision with short settling times
  • High-speed data communication with the subsystems
  • Precise placement of components for the highest quality

Assembly - Pick & place

  • Integration of various robot kinematics
  • Emphasis on shortest cycle times for highest throughput
  • Digitalized process control
  • ERP link
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Assembly
Mechanical processing
Test handler
Visual inspection
In-circuit test
Wafer production
Wet process
Selective soldering
Pick & place
Bonding